參數(shù)資料
型號(hào)： LP3962ET-5.0
廠商： NATIONAL SEMICONDUCTOR CORP
元件分類(lèi)： 基準(zhǔn)電壓源/電流源
英文描述： 1.5A Fast Ultra Low Dropout Linear Regulators
中文描述： 5 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, PSFM5
封裝： TO-220, 5 PIN
文件頁(yè)數(shù)： 16/22頁(yè)
文件大小： 484K
代理商： LP3962ET-5.0
Applications Information
(Continued)
Heatsinking TO-263 and SOT-223 Packages
The TO-263 and SOT223 packages use the copper plane on
the PCB as a heatsink. The tab of these packages are
soldered to the copper plane for heat sinking. Figure 3
shows a curve for the
θ
of TO-263 package for different
copper area sizes, using a typical PCB with 1 ounce copper
and no solder mask over the copper area for heat sinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for
θ
JA
for the TO-263 packag mounted to a PCB is
32C/W.
Figure 4 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming
θ
is 35C/W and the maximum junction tempera-
ture is 125C.
Figure 5 shows a curve for the
θ
of SOT-223 package for
different copper area sizes, using a typical PCB with 1 ounce
copper and no solder mask over the copper area for heat
sinking.
The following figures show different layout scenarios for
SOT-223 package.
10126632
FIGURE 3.
θ
JA
vs Copper(1 Ounce) Area for TO-263
package
10126633
FIGURE 4. Maximum power dissipation vs ambient
temperature for TO-263 package
10126619
FIGURE 5.
θ
JA
vs Copper(1 Ounce) Area for SOT-223
package
10126620
FIGURE 6. SCENARIO A,
θ
JA
= 148C/W
10126621
FIGURE 7. SCENARIO B,
θ
JA
= 125C/W
L
www.national.com
16
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