3 FN7873.0 June 20, 2011 Ordering Information PART NUMBER (Note 5) PART MARKING RESISTANCE OPTION (k) TEMP RANGE (°C) PACKAGE (Pb-free" />
參數(shù)資料
型號(hào): ISL23425WFRUZ-T7A
廠商: Intersil
文件頁(yè)數(shù): 14/20頁(yè)
文件大?。?/td> 0K
描述: IC DGTL POT DUAL 10K 16UTQFN
標(biāo)準(zhǔn)包裝: 1
系列: XDCP™
接片: 256
電阻(歐姆): 10k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 125 ppm/°C
存儲(chǔ)器類(lèi)型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-UFQFN
供應(yīng)商設(shè)備封裝: 16-UTQFN(2.6x1.8)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱(chēng): ISL23425WFRUZ-T7ADKR
ISL23425
3
FN7873.0
June 20, 2011
Ordering Information
PART NUMBER
(Note 5)
PART
MARKING
RESISTANCE
OPTION
(k)
TEMP RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL23425TFVZ (Notes 1, 3)
23425 TFVZ
100
-40 to +125
14 Ld TSSOP
M14.173
ISL23425UFVZ (Notes 1, 3)
23425 UFVZ
50
-40 to +125
14 Ld TSSOP
M14.173
23425WFVZ (Notes 1, 3)
23425 WFVZ
10
-40 to +125
14 Ld TSSOP
M14.173
ISL23425TFRUZ-T7A (Notes 2, 4)
GBJ
100
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
ISL23425TFRUZ-TK (Notes 2, 4)
GBJ
100
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
ISL23425UFRUZ-T7A (Notes 2, 4)
GBH
50
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
ISL23425UFRUZ-TK (Notes 2, 4)
GBH
50
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
ISL23425WFRUZ-T7A (Notes 2, 4)
GBG
10
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
ISL23425WFRUZ-TK (Notes 2, 4)
GBG
10
-40 to +125
16 Ld 2.6x1.8 TQFN
L16.2.6x1.8A
NOTES:
1. Add “-TK” suffix for 1k unit or “-T7A” suffix for 250 unit Tape and Reel options. Please refer to TB347 for details on reel specifications.
2. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate-e4
termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL23425. For more information on MSL please see techbrief TB363.
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