參數(shù)資料
型號(hào): IMSC011-W20S
廠商: 意法半導(dǎo)體
英文描述: Link adaptor
中文描述: 鏈路適配器
文件頁(yè)數(shù): 23/30頁(yè)
文件大?。?/td> 239K
代理商: IMSC011-W20S
7 Electrical specifications
/ 30
23
7.4
Power rating
Internal power dissipation (P
INT
) of transputer and peripheral chips depends on
VDD
, as shown in
figure 7.6. P
INT
is substantially independent of temperature.
Power
P
INT
(mW)
4.4
4.6
5.0
5.6
200
150
100
50
4.8
VDD (Volts)
5.2
5.4
Figure 7.6
IMS C011 internal power dissipation vs VDD
Totalpower dissipation (P
D
) of the chip is
P
D
= P
INT
+P
IO
where P
IO
is the power dissipation in the input and output pins; this is application dependent.
Internal working temperature T
J
of the chip is
T
J
=T
A
+
JA
* P
D
where T
A
is the externalambient temperature in
o
C and
in
o
C/W.
JA
is the junction-to-ambientthermal resistance
Information about device thermal management can be found in the following SGS-THOMSON cata-
logues, available from SGS-THOMSON sales offices and authorized distributors worldwide.
1 Thermal Management in Surface Mount Technology
order code: BRTHERMAN/0788
2 Reliability in Surface Mount Technology
order code: BRRELSMT/1088
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