參數(shù)資料
型號: HYB18H256321BF-14
廠商: QIMONDA AG
元件分類: DRAM
英文描述: 256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM
中文描述: 8M X 32 SYNCHRONOUS GRAPHICS RAM MODULE, 0.25 ns, PBGA136
封裝: GREEN, PLASTIC, TFBGA-136
文件頁數(shù): 37/41頁
文件大?。?/td> 1302K
代理商: HYB18H256321BF-14
HYB18H256321BF
256-Mbit GDDR3
Internet Data Sheet
Rev. 0.80, 2007-09
09132007-07EM-7OYI
37
5.2
Package Thermal Characteristics
TABLE 20
PG-TFBGA-136 Package Thermal Resistances
Notes
1. Theta_jA: Junction to Ambient thermal resistance. The values have been obtained by simulation using the conditions stated
in the JEDEC JESD-51 standard.
2. Theta_jB: Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC: Junction to Case thermal resistance. The value has been obtained by simulation.
Theta_jA
Theta_jB
Theta_jC
JEDEC Board
Air Flow
K/W
1s0p
0 m/s
40
2s0p
0 m/s
22
1 m/s
32
3 m/s
27
1 m/s
19
3 m/s
17
-
5
-
2
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