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參數(shù)資料
| 型號： | HI1-0548-5 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 17/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER 8X1 16CDIP |
| 標準包裝： | 25 |
| 功能： | 多路復用器 |
| 電路： | 1 x 8:1 |
| 導通狀態(tài)電阻： | 1.8 千歐 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 500µA |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 16-CDIP（0.300"，7.62mm） |
| 供應商設備封裝： | 16-CDIP |
| 包裝： | 管件 |
24
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HI-546, HI-547, HI-548, HI-549
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
L
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
N20.35 (JEDEC MS-018AA ISSUE A)
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.385
0.395
9.78
10.03
-
D1
0.350
0.356
8.89
9.04
3
D2
0.141
0.169
3.59
4.29
4, 5
E
0.385
0.395
9.78
10.03
-
E1
0.350
0.356
8.89
9.04
3
E2
0.141
0.169
3.59
4.29
4, 5
N20
20
6
Rev. 2 11/97
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HI1-0548B2162 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI1-0548B6084 | 制造商:Harris Corporation 功能描述: |
| HI1-0548S2212 | 制造商:Harris Corporation 功能描述: |
| HI1-0549/883 | 制造商:Intersil Corporation 功能描述:ANLG MUX DUAL 4:1 16CDIP - Rail/Tube 制造商:Rochester Electronics LLC 功能描述:MUX DIFF 4:1 OVP 16CDIP /883 - Bulk |
| HI1-0549/883 WAF | 制造商:Harris Corporation 功能描述: |
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