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參數(shù)資料
| 型號(hào)： | FBA2B4ALTE102P |
| 廠商： | KOA SPEER ELECTRONICS INC |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 4 FUNCTIONS, 0.05 A, FERRITE CHIP |
| 封裝： | EIA STD PACKAGE SIZE 1206 |
| 文件頁數(shù)： | 6/8頁 |
| 文件大?。?/td> | 168K |
| 代理商： | FBA2B4ALTE102P |
KOA SPEER ELECTRONICS, INC.
SS-224 R2
Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com
PAGE 6 OF 8
8. Chip Quantities Per Reel
Parts on 7 inch (178mm) Reel
Chip Size
2B (1206)
3,000
0.071±0.002
(1.8±0.1)
0.138±0.002
(3.5±0.1)
0.048±0.002
(1.2±0.1)
1206
(3216)
6. Packaging Specifications
KOA’s multilayer components are provided on tape-and-reel
for use in pick-and-place machines. The reel size is 7 inch.
7. Dimensions - inches (mm)
Tape
Ao
Bo
Ko
Do
E
W
F
Po
P2
D1
P1
Bo
Ko
t
Ao
0.157±0.004
(4.0±0.1)
0.157±0.004
(4.0±0.1)
0.079±0.002
(2.00±0.05)
0.059±0.004
(1.5+0.1/-0.0)
0.039 min.
(1.0 min.)
0.009±0.001
(0.23±0.02)
1206
(3216)
Tape
P1
Po
P2
Do
D1
t
0.069±0.004
(1.75±0.10)
0.138±0.002
(3.50±.005)
0.318±0.002
(8.1±0.1)
1206
(3216)
Tape
E
F
W
Item
Requirement
Conditions
Operating Temperature
-55°C ~ +125°C
Storage Temperature
40°C @ 70% Humidity
Sealed plastic bags with desiccant shall be
used to reduce the potential of oxidation on
the terminations during storage.
Resistance to Solder
Change in Impedance: Relative to value before
Flux: 5-10 sec dip
Heat
test ±20%.
After Flux: Air dry for 15 sec
Appearance: There shall be no cracking
Preheat: 150°C ±10°C
Solder Coverage: More than 75% of the terminal
Preheat Time: 60 sec
electrode shall be covered with solder.
Solder Temp: 260°C ±5°C
Dip Time: 10 ±1 sec
9. Characteristics
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