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參數(shù)資料
| 型號： | EMK33H2J-FREQTR |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 1 MHz - 125 MHz, LVHCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, PLASTIC PACKAGE-4 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 123K |
| 代理商： | EMK33H2J-FREQTR |
MANUFACTURER
CATEGORY
ECLIPTEK CORP. OSCILLATOR
SERIES
PACKAGE
VOLTAGE
EMK33
PLASTIC
CLASS
REV
.
DATE
3.3V
OS5K 11/07
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
EMK33 H 2 H - 50.000M TR
PART NUMBERING GUIDE
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape and Reel (Standard)
FREQUENCY
FREQUENCY TOLERANCE & STABILITY/
OPERATING TEMPERATURE RANGE
G=±100ppm Maximum over -40°C to +85°C
H=±50ppm Maximum over -40°C to +85°C
DUTY CYCLE
2=50% ±5%
LOGIC CONTROL
H=Tri-State (High Impedance)
J=Power Down (Logic Low)
*Compliant to EIA 481C
Tolerances= +0.1
Pin 1: Tri-State or Power Down
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
(x4)
1.40
(x4)
0.50
0.80
R S T U V
QTY/REEL
2.5 MIN
10 MIN 18.4 MAX 180 MAX 12.4 +2/-0 1,000
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13.0 ±0.2 40 MIN
REEL
PLASTIC
MARKING SPECIFICATIONS
A B C D E F
12.0 ±0.3 5.5 ±0.05 4.75 ±.05 4.0 ±0.1 2.0 ±0.1
F G H J K L
4.0 ±0.2 A0* 1.5 +.1/-0 B0* 0.3 ±0.05 K0*
Line 1: XXXX
Ecliptek Manufacturing Lot Code
Characteristic
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
Specification
MIL-STD-883, Method 3015, Class 2, HBM: 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on
bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
2.50
±0.15
0.85
±0.15
0.08
MAX
2.10
±0.10
0.20 ±0.10
*Solder connection to the bottom pads of the package only.
0.90
±0.10
(x4)
0.80 ±0.10 (x4)
3.20
±0.15
R0.45
±0.10
2
1
3
4
0.90 ±0.15
±0.10
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