
FLASH MEMORY
3
SAMSUNG
K9F1G08Q0M-YCB0,YIB0,PCB0,PIB0 K9F1G16Q0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-YCB0,YIB0,PCB0,PIB0 K9F1G16U0M-YCB0,YIB0,PCB0,PIB0      
K9F1G08U0M-VCB0,VIB0,FCB0,FIB0
GENERAL DESCRIPTION
FEATURES
 Voltage Supply 
      -1.8V device(K9F1GXXQ0M): 1.70V~1.95V
      -3.3V device(K9F1GXXU0M):  2.7 V ~3.6 V
 Organization
  - Memory Cell Array 
      -X8   device(K9F1G08X0M) : (128M + 4,096K)bit x 8bit
      -X16 device(K9F1G16X0M) : (64M + 2,048K)bit x 16bit
  - Data Register    
      -X8   device(K9F1G08X0M):  (2K + 64)bit x8bit 
      -X16 device(K9F1G16X0M):  (1K + 32)bit x16bit 
   - Cache Register
      -X8   device(K9F1G08X0M):  (2K + 64)bit x8bit 
      -X16 device(K9F1G16X0M):  (1K + 32)bit x16bit 
 Automatic Program and Erase
  - Page Program 
      -X8   device(K9F1G08X0M):  (2K + 64)Byte
      -X16 device(K9F1G16X0M):  (1K + 32)Word
  - Block Erase 
      -X8   device(K9F1G08X0M):  (128K + 4K)Byte
      -X16 device(K9F1G16X0M):  (64K + 2K)Word
 Page Read Operation
  - Page Size
     - X8   device(K9F1G08X0M):  2K-Byte
     - X16 device(K9F1G16X0M) : 1K-Word
  - Random Read : 25
μ
s(Max.)
  - Serial  Access : 50ns(Min.)
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
 Fast Write Cycle Time
  - Program time : 300
μ
s(Typ.)
  - Block Erase Time : 2ms(Typ.)
 Command/Address/Data Multiplexed I/O Port
 Hardware Data Protection
  - Program/Erase Lockout During Power Transitions
 Reliable CMOS Floating-Gate Technology
  - Endurance : 100K Program/Erase Cycles
  - Data Retention : 10 Years
 Command Register Operation
 Cache Program Operation for High Performance Program
 Power-On Auto-Read Operation
 Intelligent Copy-Back Operation
 Unique ID for Copyright Protection
 Package : 
  - K9F1GXXX0M-YCB0/YIB0
    48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
  - K9F1G08U0M-VCB0/VIB0
    48 - Pin WSOP I (12X17X0.7mm)
  - K9F1GXXX0M-PCB0/PIB0
    48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
  - K9F1G08U0M-FCB0/FIB0
    48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
      * K9F1G08U0M-V,F(WSOPI )  is the same  device as  
          K9F1G08U0M-Y,P(TSOP1)  except package type.
Offered in 128Mx8bit or 64Mx16bit, the K9F1GXXX0M is 1G bit with spare 32M bit capacity.  Its NAND cell provides the most cost-
effective solution for the solid state mass storage market. A program operation can be performed in typical 300
μ
s on the 2112-
byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device)
or 64K-word(X16 device) block. Data in the data page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for
address and data input/output as well as command input. The on-chip write controller automates all program and erase functions
including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take
advantage of the K9F1GXXX0M
′
s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with
real time mapping-out algorithm. The K9F1GXXX0M is an optimum solution for large nonvolatile storage applications such as solid
state file storage and other portable applications requiring non-volatility.               
PRODUCT LIST
Part Number
Vcc Range
Organization
PKG Type
K9F1G08Q0M-Y,P
1.70 ~ 1.95V
X8
TSOP1
K9F1G16Q0M-Y,P
X16
K9F1G08U0M-Y,P
2.7   ~ 3.6V
X8
K9F1G16U0M-Y,P
X16
K9F1G08U0M-V,F
X8
WSOP1