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| 型號： | K4H510838D-LA2 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) |
| 中文描述： | ?的512Mb芯片與DDR SDRAM的規(guī)格鉛66 TSOP-II免費（符合RoHS） |
| 文件頁數(shù)： | 9/24頁 |
| 文件大小： | 366K |
| 代理商： | K4H510838D-LA2 |
Rev. 0.3 June. 2005
DDR SDRAM
DDR SDRAM 512Mb D-die (x8, x16)
Preliminary
(V=Valid, X=Don
′
t Care, H=Logic High, L=Logic Low)
8.0 Command Truth Table
Note :
1. OP Code : Operand Code. A
0
~ A
13
& BA
0
~ BA
1
: Program keys. (@EMRS/MRS)
2. EMRS/MRS can be issued only at all banks precharge state.
A new command can be issued 2 clock cycles after EMRS or MRS.
3. Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA
0
~ BA
1
: Bank select addresses.
If both BA
0
and BA
1
are "Low" at read, write, row active and precharge, bank A is selected.
If BA
0
is "High" and BA
1
is "Low" at read, write, row active and precharge, bank B is selected.
If BA
0
is "Low" and BA
1
is "High" at read, write, row active and precharge, bank C is selected.
If both BA
0
and BA
1
are "High" at read, write, row active and precharge, bank D is selected.
5. If A
10
/AP is "High" at row precharge, BA
0
and BA
1
are ignored and all banks are selected.
6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at t
RP
after the end of burst.
7. Burst stop command is valid at every burst length.
8. DM(x4/8) sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
UDM/LDM(x16 only) sampled at the rising and falling edges of the UDQS/LDQS and Data-in are masked at the both edges
(Write UDM/LDM latency is 0).
9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM.
COMMAND
CKEn-1 CKEn
CS
RAS
CAS
WE
BA0,1
A10/AP
A0 ~ A9,
A11 ~ A12
Note
Register
Extended MRS
H
X
L
L
L
L
OP CODE
1, 2
Register
Mode Register Set
H
X
L
L
L
L
OP CODE
1, 2
Refresh
Auto Refresh
H
H
L
L
L
H
X
3
Self
Refresh
Entry
L
3
Exit
L
H
L
H
H
H
X
3
H
X
X
X
3
Bank Active & Row Addr.
H
X
L
L
H
H
V
Row Address
Read &
Column Address
Auto Precharge Disable
H
X
L
H
L
H
V
L
Column
Address
4
Auto Precharge Enable
H
4
Write &
Column Address
Auto Precharge Disable
H
X
L
H
L
L
V
L
Column
Address
4
Auto Precharge Enable
H
4, 6
Burst Stop
H
X
L
H
H
L
X
7
Precharge
Bank Selection
H
X
L
L
H
L
V
L
X
All Banks
X
H
5
Active Power Down
Entry
H
L
H
X
X
X
X
L
V
V
V
Exit
L
H
X
X
X
X
Precharge Power Down Mode
Entry
H
L
H
X
X
X
X
L
H
H
H
Exit
L
H
H
X
X
X
L
V
V
V
DM(UDM/LDM for x16 only)
H
X
X
8
No operation (NOP) : Not defined
H
X
H
X
X
X
X
9
L
H
H
H
9
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| K4H510838D-LB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) |
| K4H510838D-LB3 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) |
| K4H510838D-LCC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) |
| K4H510838D-TCA0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:128Mb DDR SDRAM |
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