參數(shù)資料
型號： DAC7654YTG4
廠商： TEXAS INSTRUMENTS INC
元件分類： DAC
英文描述： SERIAL INPUT LOADING, 12 us SETTLING TIME, 16-BIT DAC, PQFP64
封裝： GREEN, PLASTIC, LQFP-64
文件頁數(shù)： 12/33頁
文件大?。?/td> 804K
代理商： DAC7654YTG4
DAC7654
SBAS263A NOVEMBER 2003 REVISED DECEMBER 2005
www.ti.com
2
ORDERING INFORMATION(1)
PRODUCT
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DAC7654Y
LQFP64
PM
40
°C to +85°C
DAC7654Y
DAC7654YT
Tape and Reel, 250
DAC7654Y
LQFP64
PM
40
°C to +85°C
DAC7654Y
DAC7654YR
Tape and Reel, 1500
DAC7654YB
LQFP64
PM
40
°C to +85°C
DAC7654YB
DAC7654YBT
Tape and Reel, 250
DAC7654YB
LQFP64
PM
40
°C to +85°C
DAC7654YB
DAC7654YBR
Tape and Reel, 1500
DAC7654YC
LQFP64
PM
40
°C to +85°C
DAC7654YC
DAC7654YCT
Tape and Reel, 250
DAC7654YC
LQFP64
PM
40
°C to +85°C
DAC7654YC
DAC7654YCR
Tape and Reel, 1500
(1) For the most current specification and package information, see the Package Ordering Addendum at the end of this data sheet.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
DAC7654
UNIT
IOVDD, VCC and VDD to VSS
0.3 to 11
V
IOVDD, VCC and VDD to GND
0.3 to 5.5
V
Digital Input Voltage to GND
0.3 to VDD + 0.3
V
Digital Output Voltage to GND
0.3 to VDD + 0.3
V
ESD-CDM
200
V
Maximum Junction Temperature
+150
°C
Operating Temperature Range
40 to +85
°C
Storage Temperature Range
65 to +125
°C
Lead Temperature (soldering, 10s)
+300
°C
(1) Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond
those specified is not implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
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