
December 2012
I
 2012 Microsemi Corporation
IGLOO Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
 1.2 V to 1.5 V Core Voltage Support for Low Power
 Supports Single-Voltage System Operation
 5 W Power Consumption in Flash*Freeze Mode
 Low Power Active FPGA Operation
 Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
 Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
High Capacity
 15K to 1 Million System Gates
 Up to 144 Kbits of True Dual-Port SRAM
 Up to 300 User I/Os
Reprogrammable Flash Technology
 130-nm, 7-Layer Metal, Flash-Based CMOS Process
 Instant On Level 0 Support
 Single-Chip Solution
 Retains Programmed Design When Powered Off
 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
In-System Programming (ISP) and Security
 ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption (except ARM-enabled IGLOO devices) via
JTAG (IEEE 1532–compliant)
 FlashLock Designed to Secure FPGA Contents
High-Performance Routing Hierarchy
 Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
 700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)
 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
 Bank-Selectable I/O Voltages—up to 4 Banks per Chip
 Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-
X,and LVCMOS 2.5 V / 5.0 V Inpu
t Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-
LVDS (AGL250 and above)
 Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
 Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
 I/O Registers on Input, Output, and Enable Paths
 Hot-Swappable and Cold-Sparing I/Os
 Programmable Output Slew Rate
 and Drive Strength
 Weak Pull-Up/-Down
 IEEE 1149.1 (JTAG) Boundary Scan Test
 Pin-Compatible Packages across the IGLOO Family
Clock Conditioning Circuit (CCC) and PLL  Six CCC Blocks, One with an Integrated PLL
 Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
 Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
 1 kbit of FlashROM User Nonvolatile Memory
 SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
 RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
 True Dual-Port SRAM (except ×18)
ARM Processor Support in IGLOO FPGAs
 M1 IGLOO Devices—Cortex-M1 Soft Processor Available
with or without Debug
 AGL015 and AGL030 devices do not support this feature.
 Supported only by AGL015 and AGL030 devices.
IGLOO Devices
AGL0151
AGL030
AGL060 AGL125
AGL250
AGL400
AGL600
AGL1000
ARM-Enabled IGLOO Devices2
M1AGL250
M1AGL600
M1AGL1000
System Gates
15,000
30,000
60,000
125,000
250,000
400,000
600,000
1,000,000
Typical Equivalent Macrocells
128
256
512
1,024
2,048
–
VersaTiles (D-flip-flops)
384
768
1,536
3,072
6,144
9,216
13,824
24,576
Flash*Freeze Mode (typical, W)
5
10
16
24
32
36
53
RAM kbits (1,024 bits)
–
18
36
54
108
144
4,608-Bit Blocks
–
4
8
12
24
32
FlashROM Kbits (1,024 bits)
1
AES-Protected ISP 2
–
Yes
Integrated PLL in CCCs 3
––
1
VersaNet Globals 4
6
18
I/O Banks
2
4
Maximum User I/Os
49
81
96
133
143
194
235
300
Package Pins
UC/CS
QFN
VQFP
FBGA
QN68
UC81
CS81
QN48, QN68,
QN132
VQ100
CS121 3
QN132
VQ100
FG144 6
CS196
QN132
VQ100
FG144
CS81, CS196 5
QN132 5,6
VQ100
FG144
CS196
FG144, FG256,
FG484
CS281
FG144, FG256,
FG484
CS281
FG144, FG256,
FG484
Notes:
1. AGL015 is not recommended for new designs
2. AES is not available for ARM-enabled IGLOO devices.
3. AGL060 in CS121 does not support the PLL.
4. Six chip (main) and twelve quadrant global networks are available for AGL060 and above.
5. The M1AGL250 device does not support this package.
6. Device/package support TBD.
Revision 23