詳細信息
1.3mm Pitch Board to Board Connector
特長
- 1. Due to HZ unique contact structure, this product achieves a highly reliable, stable connection.
- 2. Equipped with a locking mechanism in the terminal and reinforcement terminal, it contributes to improved usability.
- 3. In addition to its compact and space-saving design, it supports automatic mounting by providing adsorption space.
- 4. Achieves a low profile with a mating height of 0.9mm.
- 5. Features a flux prevention mechanism.
- 6. RoHS compliant product.
規(guī)格
間距：嵌合高度：本體寬度：極數(shù)：額定電壓電流：接觸電阻：絕緣電阻：耐電壓：使用溫度范圍：
| 1.3mm |
| 0.9mm |
| 2.8mm(Socket) |
| 6 |
| AC/DC 30V 4.0A(Power Pin)/1.0A(Signal Pin) |
| 20mΩ max., initially |
| 1,000MΩ min. at 200V DC |
| 500V AC (for one minute) |
| －25℃～ ＋85℃ |
材質(zhì)??表面處理
插座外殼：插座接點：插座壓具：插頭外殼：插頭接點：插頭壓具：
| Thermoplastic Resin |
| Cu Alloy, Au Plating |
| Cu Alloy, Sn Alloy Plating |
| Thermoplastic Resin |
| Cu Alloy, Au Plating |
| Cu Alloy, Sn Alloy Plating |
用途
- Mobile phones, Smartphone, digital camera, other mobile equipment