參數(shù)資料
型號(hào): BZA109
廠商: NXP SEMICONDUCTORS
元件分類: 參考電壓二極管
英文描述: 9-fold ESD transient voltage suppressor(9迭層ESD瞬變電壓抑制器)
中文描述: 25 W, UNIDIRECTIONAL, 18 ELEMENT, SILICON, TVS DIODE, MS-013AC
封裝: PLASTIC, SO-20
文件頁(yè)數(shù): 7/12頁(yè)
文件大?。?/td> 144K
代理商: BZA109
1997 Dec 01
7
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA109 is
determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended:
1.
Place the suppression element close to the input terminals or connectors.
2.
Keep parallel signal paths to a minimum.
3.
Avoid running protection conductors in parallel with unprotected conductors.
4.
Minimize all printed-circuit board loop areas including power and ground loops.
5.
Minimize the length of the transient return path to ground.
6.
Avoid using shared transient return paths to a common ground point.
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