參數(shù)資料
型號(hào)： ATSAM3A4CA-CU
廠商： Atmel
文件頁(yè)數(shù)： 24/71頁(yè)
文件大?。?/td> 0K
描述： IC MCU 2X128KB CORTEX-M3 100-BGA
標(biāo)準(zhǔn)包裝： 260
系列： SAM3A
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 84MHz
連通性： CAN，I²C，IrDA，LIN，MMC，SPI，SSC，UART/USART，USB
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，I²S，POR，PWM，WDT
輸入/輸出數(shù)： 63
程序存儲(chǔ)器容量： 256KB（256K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 64K x 8
電壓 - 電源 (Vcc/Vdd)： 1.62 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b，D/A 2x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 100-TFBGA
包裝： 托盤(pán)
32
11057BS–ATARM–13-Jul-12
SAM3X/A
32
11057BS–ATARM–13-Jul-12
SAM3X/A
7.
Processor and Architecture
7.1
ARM Cortex-M3 Processor
Version 2.0
Thumb-2 (ISA) subset consisting of all base Thumb-2 instructions, 16-bit and 32-bit.
Harvard processor architecture enabling simultaneous instruction fetch with data load/store.
Three-stage pipeline.
Single cycle 32-bit multiply.
Hardware divide.
Thumb and Debug states.
Handler and Thread modes.
Low latency ISR entry and exit.
7.2
APB/AHB Bridge
The SAM3X/A series product embeds two separate APB/AHB bridges:
a low speed bridge
a high speed bridge
This architecture enables a concurrent access on both bridges.
SPI, SSC and HSMCI peripherals are on the high-speed bridge connected to DMAC with the
internal FIFO for Channel buffering.
UART, ADC, TWI0-1, USART0-3, PWM, DAC and CAN peripherals are on the low-speed bridge
and have dedicated channels for the Peripheral DMA Channels (PDC). Please not that
USART0-1 can be used with the DMA as well.
The peripherals on the high speed bridge are clocked by MCK. On the low-speed bridge, CAN
controllers can be clocked at MCK divided by 2 or 4. Refer to the Power Management Controller
(PMC) section of the Full datasheet for further details.
7.3
Matrix Masters
The Bus Matrix of the SAM3X/A series product manages 5 (SAM3A) or 6 (SAM3X) masters,
which means that each master can perform an access, concurrently with others, to an available
slave.
Each master has its own decoder, which is defined specifically for each master. In order to sim-
plify the addressing, all masters have the same decodings.
Table 7-1.
List of Bus Matrix Masters
Master 0
Cortex-M3 Instruction/Data
Master 1
Cortex-M3 System
Master 2
Peripheral DMA Controller (PDC)
Master 3
USB OTG High Speed DMA
Master 4
DMA Controller
Master 5
Ethernet MAC (SAM3X)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ATSAM3A8CA-AU 功能描述:ARM微控制器 - MCU QFP100,GREEN, IND TEMP, MRLA RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
ATSAM3A8CA-CU 功能描述:ARM微控制器 - MCU BGA100,GREEN, IND TEMP, MRLA RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
ATSAM3N00AA-AU 功能描述:ARM微控制器 - MCU LQFP, Green, IND TEMP, MRL a RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
ATSAM3N00AA-AUR 制造商:Atmel Corporation 功能描述:LQFP,GREEN,IND TEMP,MRL A,T&R - Tape and Reel 制造商:Atmel Corporation 功能描述:IC MCU 32BIT 16KB FLASH 48LQFP
ATSAM3N00AA-MU 功能描述:ARM微控制器 - MCU QFN,GREEN,IND TEMP,MRL A RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
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