參數(shù)資料
型號(hào): AT91FR4042-CI
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: AT91 ARM Thumb Microcontrollers
中文描述: 32-BIT, FLASH, 70 MHz, RISC MICROCONTROLLER, PBGA121
封裝: 10 X 10 MM, 1.20 MM HEIGHT, BGA-121
文件頁數(shù): 21/22頁
文件大小: 195K
代理商: AT91FR4042-CI
21
AT91FR4042
2648D–ATARM–03/04
Soldering Profile
Table 8 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards
with larger components. In this case, small packages may have to withstand tempera-
tures of up to 235
°
C, not 220
°
C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume.
See Table 9.
Notes:
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or
VPR.
2. By default, the package level 1 is qualified at 220
°
C (unless 235
°
C is stipulated).
3. The body temperature is the most important parameter but other profile parameters
such as total exposure time to hot temperature or heating rate may also influence
component reliability.
A maximum of three reflow passes is allowed per component.
Table 8.
Soldering Profile
Convection or
IR/Convection
VPR
Average Ramp-up Rate (183
°
C to Peak)
3
°
C/sec. max.
10
°
C/sec.
Preheat Temperature 125
°
C ±25
°
C
120 sec. max
Temperature Maintained Above 183
°
C
60 sec. to 150 sec.
Time within 5
°
C of Actual Peak
Temperature
10 sec. to 20 sec.
60 sec.
Peak Temperature Range
220 +5/-0
°
C or
235 +5/-0
°
C
215 to 219
°
C or
235 +5/-0
°
C
Ramp-down Rate
6
°
C/sec.
10
°
C/sec.
Time 25
°
C to Peak Temperature
6 min. max
Table 9.
Recommended Package Reflow Conditions
(1, 2, 3)
Parameter
Temperature
Convection
220 +5/-0
°
C
VPR
215 to 219
°
C
IR/Convection
220 +5/-0
°
C
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