參數(shù)資料
型號: AS8510-ASST-500
廠商: ams
文件頁數(shù): 45/47頁
文件大小: 0K
描述: IC BATTERY MANAGEMENT 20-SSOP
產(chǎn)品培訓模塊: AS8510 Data Acquisition IC
標準包裝: 1
類型: 電池管理
輸入類型: 模擬,數(shù)字
輸出類型: 模擬,數(shù)字
接口: SPI 串行
電流 - 電源: 5.5mA
安裝類型: 表面貼裝
封裝/外殼: 20-SSOP(0.209",5.30mm 寬)
供應商設備封裝: 20-SSOP
包裝: 標準包裝
其它名稱: AS8510-ASST-500DKR
Revision 3.5
6 - 46
AS8510
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Electrical Parameters
DC supply voltage (AVDD and DVDD)
-0.3
5
V
Input voltage (VIN)-0.3
AVDD + 0.3
DVDD + 0.3
V
Input current (latchup immunity)
(ISCR)
-100
100
mA
AEC - Q100 - 004
Electrostatic Discharge
Electrostatic discharge (ESD) all pins
±2
kV
AEC - Q100 - 002
Continuous Power Dissipation
Total power dissipation
(all supplies and outputs) (Pt)
50
mW
SSOP20 in still air, soldered on JEDEC
standard board @ 125 ambient, static
operation with no time limit
Temperature Ranges and Storage Conditions
Storage temperature (TSTRG)
-50
125
C
Junction temperature (TJ)130
C
Thermal resistance (RthJC)
80
K/W
JEDEC standard test board, 0 air velocity
Package body temperature (TBODY)
260
C
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature (body
temperature) is specified according IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
85
%
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