參數(shù)資料
型號: ADSP-BF531SBBZ400
廠商: ANALOG DEVICES INC
元件分類: 數(shù)字信號處理
英文描述: Blackfin Embedded Processor
中文描述: 16-BIT, 40 MHz, OTHER DSP, PBGA169
封裝: ROHS COMPLIANT, PLASTIC, MO-034AAG-2, BGA-169
文件頁數(shù): 56/56頁
文件大?。?/td> 671K
代理商: ADSP-BF531SBBZ400
Rev. 0
|
Page 56 of 56
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March 2004
ADSP-BF531/ADSP-BF532/ADSP-BF533
2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03728-0-3/04(0)
ORDERING GUIDE
Part Number
Temperature
Range
(Ambient )
Package Description
Instruction
Rate (Max)
Operating Voltage
ADSP-BF533SKBC600 0oC to 70oC
ADSP-BF533SBBC500 –40oC to 85oC Chip Scale Package Ball Grid Array (mini-BGA) BC-160 500 MHz
ADSP-BF533SBBZ500
1
–40oC to 85oC Plastic Ball Grid Array (PBGA) B-169
ADSP-BF532SBBC400 –40oC to 85oC Chip Scale Package Ball Grid Array (mini-BGA) BC-160 400 MHz
ADSP-BF532SBST400 –40oC to 85oC Quad Flatpack (LQFP) ST-176-1
ADSP-BF532SBBZ400
1
–40oC to 85oC Plastic Ball Grid Array (PBGA) B-169
ADSP-BF531SBBC400 –40oC to 85oC Chip Scale Package Ball Grid Array (mini-BGA) BC-160 400 MHz
ADSP-BF531SBST400 –40oC to 85oC Quad Flatpack (LQFP) ST-176-1
ADSP-BF531SBBZ400
1
–40oC to 85oC Plastic Ball Grid Array (PBGA) B-169
Chip Scale Package Ball Grid Array (mini-BGA) BC-160 600 MHz
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1
Z = Pb-free part.
500 MHz
400 MHz
400 MHz
400 MHz
400 MHz
相關(guān)PDF資料
PDF描述
ADSP-BF531SBST400 Circular Connector Series:97
ADSP-BF532 Blackfin Embedded Processor
ADSP-BF532SBBC400 Blackfin Embedded Processor
ADSP-BF532SBBZ400 Blackfin Embedded Processor
ADSP-BF532SBST400 28-2 (14 Contacts) Pin Insert; For Use With:Amphenol MIL-C-5015 97 Series Circular Connectors; No. of Contacts:14; Gender:Male; Operating Voltage:1250V
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