參數(shù)資料
型號: ADF4007BCP
廠商: ANALOG DEVICES INC
元件分類: XO, clock
英文描述: High Frequency Divider/PLL Synthesizer
中文描述: PLL FREQUENCY SYNTHESIZER, 7500 MHz, QCC20
封裝: MO-220-VGGD-1, LFCSP-20
文件頁數(shù): 13/16頁
文件大?。?/td> 390K
代理商: ADF4007BCP
ADF4007
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The lands on the chip scale package (CP-20) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the pad
to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. The printed circuit board should
have a clearance of at least 0.25 mm between the thermal pad
and the inner edges of the pad pattern to ensure that shorting is
avoided.
Rev. 0 | Page 13 of 16
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.30 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
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