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參數(shù)資料
| 型號： | AD9858BSVZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 29/32頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DDS DAC 10BIT 1GSPS 100-TQFP |
| 產(chǎn)品培訓(xùn)模塊： | Direct Digital Synthesis Tutorial Series (1 of 7): Introduction Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator |
| 設(shè)計(jì)資源： | Low Jitter Sampling Clock Generator for High Performance ADCs Using AD9958/9858 and AD9515 (CN0109) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 分辨率（位）： | 10 b |
| 主 fclk： | 1GHz |
| 調(diào)節(jié)字寬（位）： | 32 b |
| 電源電壓： | 3.14 V ~ 3.47 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 100-TQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 100-TQFP-EP（14x14） |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 552 (CN2011-ZH PDF) |
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AD9858
Rev. C | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Maximum Junction Temperature
150°C
AVDD
4 V
DVDD
4 V
CPVDD
6 V
Digital Input Voltage Range
0.7 V to +VDD
Digital Output Current
5 mA
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
Table 3.
Symbol
Description (Using a 2S2P Test Board)
Value (°C/W)
θ
JA
Junction-to-ambient thermal resistance,
0.0 m/sec airflow per JEDEC JESD51-2
(still air)
19.8
θ
JMA
Junction-to-ambient thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-6
(moving air)
15.6
θ
JMA
Junction-to-ambient thermal resistance,
2.0 m/sec airflow per JEDEC JESD51-6
(moving air)
14.6
θ
JB
Junction-to-board thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-8
(moving air)
8.2
θ
JC
Junction-to-case thermal resistance
(die to heat sink) per MIL-STD-883,
Method 1012.1
0.6
ΨJT
Junction-to-top-of-package
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-2 (still air)
0.15
The AD9858 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source may be used.
To determine the junction temperature on the application
printed circuit board (PCB),
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of package.
PD is the power dissipation (see the total power dissipation in
Table 1).
Values of θJA are provided for package comparison and
PCB design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided for package comparison and PCB
design considerations (see Table 3).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required
(see Table 3).
EXPLANATION OF TEST LEVELS
I.
100% production tested.
III.
Sample tested only.
IV.
Parameter is guaranteed by design and characterization
testing.
V.
Parameter is a typical value only.
VI.
Devices are 100% production tested at 25°C and guaranteed
by design and characterization testing for industrial
operating temperature range.
ESD CAUTION
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