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參數(shù)資料
| 型號： | AD8194ACPZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 11/16頁 |
| 文件大小： | 0K |
| 描述： | IC SWITCH TMDS BUFF 2:1 32LFCSP |
| 標(biāo)準(zhǔn)包裝： | 1,500 |
| 功能： | 開關(guān) |
| 電路： | 4 x 2:1 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 32-LFCSP-VQ |
| 包裝： | 帶卷 (TR) |
AD8194
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
AVCC to AVEE
3.7 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
Internal Power Dissipation
1.2 W
High Speed Input Voltage
AVCC 1.4 V < VIN < AVCC + 0.6 V
High Speed Differential
Input Voltage
2.0 V
Source Select (S_SEL)
AVEE 0.3 V < VIN < AVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature
Range
40°C to +85°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions: a device soldered
in a 4-layer JEDEC circuit board for surface-mount packages.
θ
JC
is specified for the exposed pad soldered to the circuit board
with no airflow.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
32-Lead LFCSP
47
6.8
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8194 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation,
it is necessary to observe the maximum power derating as
determined by the coefficients in Table 3.
ESD CAUTION
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| AD8194-EVALZ | 制造商:Analog Devices 功能描述:EVAL BD FOR AD8194 - Bulk |
| AD8195ACPZ | 功能描述:IC BUFF HDMI/DVI W/EQUAL 40LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 其它有關(guān)文件:STG4159 View All Specifications 標(biāo)準(zhǔn)包裝:5,000 系列:- 功能:開關(guān) 電路:1 x SPDT 導(dǎo)通狀態(tài)電阻:300 毫歐 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±1.65 V ~ 4.8 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:7-WFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:7-覆晶 包裝:帶卷 (TR) |
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| AD8195-EVALZ | 制造商:Analog Devices 功能描述:EVALUATION BOARD - Boxed Product (Development Kits) |
| AD8195XCPZ | 功能描述:IC BUFF HDMI/DVI W/EQUAL 40LFCSP 制造商:analog devices inc. 系列:- 包裝:托盤 零件狀態(tài):上次購買時間 類型:HDMI/DVI 緩沖器 應(yīng)用:HDTV 安裝類型:表面貼裝 封裝/外殼:40-VFQFN 裸露焊盤，CSP 供應(yīng)商器件封裝:40-LFCSP-VQ（6x6） 標(biāo)準(zhǔn)包裝:1 |
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