參數(shù)資料
型號(hào)： AD8139
廠商： Analog Devices, Inc.
英文描述： Low Noise Rail-to-Rail Differential ADC Driver
中文描述： 低噪聲軌至軌差分ADC驅(qū)動(dòng)器
文件頁(yè)數(shù)： 24/24頁(yè)
文件大小： 720K
代理商： AD8139
AD8139
OUTLINE DIMENSIONS
Rev. A | Page 24 of 24
0.25 (0.0098)
0.17 (0.0068)
0.25 (0.0098)
0.10 (0.0039)
1.27 (0.050)
0.40 (0.016)
0.50 (0.020)
0.25 (0.010)
1.75 (0.069)
1.35 (0.053)
SEATING
PLANE
4
1
5.00(0.197)
4.90 (0.193)
4.80(0.189)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
1.27 (0.05)
BSC
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
0.51 (0.020)
0.31 (0.012)
COPLANARITY
0.10
TOP VIEW
2.29 (0.092)
BOTTOM VIEW
(PINS UP)
2.29 (0.092)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012
×
45°
8°
0°
8
5
Figure 63. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC/EP], Narrow Body (RD-8-1)—Dimensions shown in millimeters and (inches)
1
EXPOSED
(BOTTOM VIEW)
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50
REF
0.50
0.40
0.30
0.25
MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65TYP
SEATING
PLANE
INDICPIN 1
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
1.90
1.75
1.60
4
1.60
1.45
1.30
3.00
BSC SQ
5
8
Figure 64. 8-Lead Lead Frame Chip Scale Package [LFCSP], 3 mm × 3 mm Body (CP-8-2)—Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8139ARD
AD8139ARD-REEL
AD8139ARD-REEL7
AD8139ARDZ
1
AD8139ARDZ-REEL
1
AD8139ARDZ-REEL7
1
AD8139ACP-R2
AD8139ACP-REEL
AD8139ACP-REEL7
AD8139ACPZ-R2
1
AD8139ACPZ-REEL
1
AD8139ACPZ-REEL7
1
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
Package Option
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
Branding
HEB
HEB
HEB
HEB
HEB
HEB
1
Z = Pb-free part.
2004 Analog Devices, Inc. All rights reserved. Trademarks and
regis-
tered trademarks are the property of their respective owners.
D04679–0–8/04(A)
相關(guān)PDF資料
PDF描述
AD8139ACPZ-R21 PTSE 11C 11#16 STR PLUG
AD8139ACP-R2 Low Noise Rail-to-Rail Differential ADC Driver
AD8139ACPZ-REEL Low Noise Rail-to-Rail Differential ADC Driver
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AD8146ACPZ-R2 Triple Differential Driver for Wideband Video
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD8139_07 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:Low Noise, Rail-to-Rail, Differential ADC Driver
AD8139ACP 制造商:Analog Devices 功能描述:ULTRA LOW NOISE FULLY DIFFERENTIAL ADC DRIVER - Bulk
AD8139ACP-EBZ 功能描述:BOARD EVAL FOR AD8139ACP RoHS:是 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:-
AD8139ACP-R2 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single R-R O/P ±6V/12V 8-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:HIGH PERFORMANCE LOW NOISE ADC DRIVER - Bulk
AD8139ACP-REEL 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single R-R O/P ±6V/12V 8-Pin LFCSP EP T/R
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