參數(shù)資料
型號: AD620BRZ-RL
廠商: Analog Devices Inc
文件頁數(shù): 11/21頁
文件大?。?/td> 0K
描述: IC AMP INST LP LN 18MA 8SOIC
設(shè)計資源: Low Cost Programmable Gain Instrumentation Amplifier Circuit Using ADG1611 and AD620 (CN0146)
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 儀表
電路數(shù): 1
轉(zhuǎn)換速率: 1.2 V/µs
-3db帶寬: 1MHz
電流 - 輸入偏壓: 500pA
電壓 - 輸入偏移: 15µV
電流 - 電源: 900µA
電流 - 輸出 / 通道: 18mA
電壓 - 電源,單路/雙路(±): 4.6 V ~ 36 V,±2.3 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
AD620
Rev. H | Page 18 of 20
AD620ACHIPS INFORMATION
Die size: 1803 μm × 3175 μm
Die thickness: 483 μm
Bond Pad Metal: 1% Copper Doped Aluminum
To minimize gain errors introduced by the bond wires, use Kelvin connections between the chip and the gain resistor, RG, by connecting
Pad 1A and Pad 1B in parallel to one end of RG and Pad 8A and Pad 8B in parallel to the other end of RG. For unity gain applications
where RG is not required, Pad 1A and Pad 1B must be bonded together as well as the Pad 8A and Pad 8B.
1A
1B
2
3
4
5
6
7
8A
8B
LOGO
00
775-
0-
053
Figure 49. Bond Pad Diagram
Table 6. Bond Pad Information
Pad Coordinates1
Pad No.
Mnemonic
X (μm)
Y (μm)
1A
RG
623
+1424
1B
RG
789
+628
2
IN
790
+453
3
+IN
790
294
4
VS
788
1419
5
REF
+570
1429
6
OUTPUT
+693
1254
7
+VS
+693
+139
8A
RG
+505
+1423
8B
RG
+693
+372
1 The pad coordinates indicate the center of each pad, referenced to the center of the die. The die orientation is indicated by the logo, as shown in Figure 49.
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