- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄2131 > 6232B-MTG (Aavid Thermalloy)BOARD LEVEL HEAT SINK PDF資料下載
參數(shù)資料
| 型號(hào)： | 6232B-MTG |
| 廠商： | Aavid Thermalloy |
| 文件頁(yè)數(shù)： | 2/116頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 產(chǎn)品培訓(xùn)模塊： | How to Select a Heat Sink |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類型： | 插件板級(jí)，垂直 |
| 冷卻式包裝： | TO-220 |
| 固定方法： | 螺栓固定和 PC 引腳 |
| 形狀： | 矩形 |
| 長(zhǎng)度： | 1.774"（45.06mm） |
| 寬： | 1.378"（35.00mm） |
| 機(jī)座外的高度（散熱片高度）： | 0.512"（13.00mm） |
| 溫升時(shí)的功耗： | 3W @ 40°C |
| 在強(qiáng)制氣流下的熱敏電阻： | 在 400 LFM 時(shí)為4°C/W |
| 自然環(huán)境下的熱電阻： | 10°C/W |
| 材質(zhì)： | 鋁 |
| 材料表面處理： | 黑色陽(yáng)極化處理 |
| 其它名稱： | 042268 |
第1頁(yè)當(dāng)前第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)
10
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD = 12 watts
RθJC = 2.5°C/W (from semiconductor manufacturer)
TJ max = 140°C (from semiconductor manufacturer)
TA max = 50°C
A Hi-Flow pad works great with clip mounting and provides the
necessary electrical insulation. Thermal resistance for
Hi-Flow at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for RθSA
RθSA = 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W. This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0” tall
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Given:
PD = 6 watts
RθJC = 3°C/W (from semiconductor manufacturer)
TJ max = 150°C (from semiconductor manufacturer)
TA max = 65°C
A KonduxTM pad is a good choice for electrically conductive
applications. Thermal resistance for KonduxTM can be determined
from the following graph.
Example B
Example A
Typical TO-220 Performance
Screw Torque (in-lb)
0.00
012
3
4
5
R
(C/W
)
CS
0.10
0.20
0.30
0.40
0.50
0.60
6
How To Select a Heat Sink
At 2 in-lb of torque the thermal resistance
is approximately RθCS = 0.5°C/W
Using equation 1, solve for RθSA
RθSA = 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
RθSA = 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53330X
53320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Hi-Flow is a trademark of the Bergquist Company
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 6236BG | BOARD LEVEL HEAT SINK |
| 6239B-MTG | BOARD LEVEL HEAT SINK |
| 624HH | FAN 60X25.4MM 24VDC 33CFM |
| 624H | FAN 60X25.4MM 24VDC 27.1CFM |
| 624L | FAN 60X25.4MM 24VDC 12.4CFM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 623-2CCSF | 制造商:Carlisle Interconnect Components 功能描述:RF COAXIAL PANEL MOUNT CONNECTOR |
| 6232PB-MT | 制造商:Aavid Thermalloy 功能描述:- Bulk 制造商:Aavid Thermalloy 功能描述:Heat Sink Passive TO-220 Staggered Thru-Hole 10°C/W Pre-Black Anodized |
| 6232-SS-0632-7 | 制造商:Amatom Electronic Hardware 功能描述: |
| 6233 | 制造商:PAYTON 功能描述: 制造商:Coto Technology 功能描述: |
| 6233 4G | 功能描述:SCOTCHKOTE FUSION-BONDED EPOXY C 制造商:3m 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:65 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。